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PLUS173DN Scheda tecnica(PDF) 5 Page - NXP Semiconductors

Il numero della parte PLUS173DN
Spiegazioni elettronici  Programmable logic arrays 22 횞 42 횞 10
PDF  8 Pages
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Produttore elettronici  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PLUS173DN Scheda tecnica(HTML) 5 Page - NXP Semiconductors

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Philips Semiconductors Programmable Logic Devices
Product specification
PLUS173B/D
Programmable logic arrays
(22
× 42 × 10)
October 22, 1993
37
AC ELECTRICAL CHARACTERISTICS
0
°C ≤ Tamb ≤ +75°C, 4.75 ≤ VCC ≤ 5.25V, R1 = 300Ω, R2 = 390Ω
LIMITS
SYMBOL
PARAMETER
FROM
TO
TEST
PLUS173B
PLUS173D
UNIT
CONDITION
MIN
TYP
MAX
MIN
TYP
MAX
tPD
Propagation Delay2
Input +/–
Output +/–
CL = 30pF
11
15
10
12
ns
tOE
Output Enable1
Input +/–
Output –
CL = 30pF
11
15
10
12
ns
tOD
Output Disable1
Input +/–
Output +
CL = 5pF
11
15
10
12
ns
NOTES:
1. For 3-State outputs; output enable times are tested with CL = 30pF to the 1.5V level, and S1 is open for high-impedance to High tests and
closed for high-impedance to Low tests. Output disable times are tested with CL = 5pF. High-to-High impedance tests are made to an output
voltage of VT = (VOH – 0.5V) with S1 open, and Low-to-High impedance tests are made to the VT = (VOL + 0.5V) level with S1 closed.
2. All propagation delays are measured and specified under worst case conditions.
VOLTAGE WAVEFORM
MEASUREMENTS:
All circuit delays are measured at the +1.5V level
of inputs and outputs, unless otherwise specified.
90%
10%
5ns
5ns
5ns
5ns
90%
10%
+3.0V
+3.0V
0V
0V
tR
tF
Input Pulses
TIMING DEFINITIONS
SYMBOL
PARAMETER
tPD
Propagation delay between
input and output.
tOD
Delay between input change
and when output is off (Hi-Z
or High).
tOE
Delay between input change
and when output reflects
specified output level.
TEST LOAD CIRCUIT
TIMING DIAGRAM
Test Load Circuit
+5V
CL
R1
R2
S1
GND
BZ
BZ
INPUTS
In
In
BM
BM
OUTPUTS
C2
C1
DUT
NOTE:
C1 and C2 are to bypass VCC to GND.
VCC
+3V
0V
VOH
VOL
I, B
B
tPD
1.5V
1.5V
1.5V
1.5V
1.5V
tOD
tOE
VT



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