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PLUS173DN Scheda tecnica(PDF) 1 Page - NXP Semiconductors |
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PLUS173DN Scheda tecnica(HTML) 1 Page - NXP Semiconductors |
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1 / 8 page ![]() Philips Semiconductors Programmable Logic Devices Product specification PLUS173B/D Programmable logic arrays (22 × 42 × 10) 33 October 22, 1993 853–1298 11164 DESCRIPTION The PLUS173 PLDs are high speed, combinatorial Programmable Logic Arrays. The Philips Semiconductors state-of-the-art Oxide Isolated Bipolar fabrication process is employed to produce propagation delays as short as 12ns. The 24-pin PLUS173 devices have a programmable AND array and a programmable OR array. Unlike PAL ® devices, 100% product term sharing is supported. Any of the 32 logic product terms can be connected to any or all of the 10 output OR gates. Most PAL ICs are limited to 7 AND terms per OR function; the PLUS173 devices can support up to 32 input wide OR functions. The polarity of each output is user- programmable as either Active-High or Active-Low, thus allowing AND-OR or AND-NOR logic implementation. This feature adds an element of design flexibility, particularly when implementing complex decoding functions. The PLUS173 devices are user- programmable using one of several commercially available, industry standard PLD programmers. FEATURES • I/O propagation delays (worst case) – PLUS173B – 15ns max. – PLUS173D – 12ns max. • Functional superset of 20L10 and most other 24-pin combinatorial PAL devices • Two programmable arrays – Supports 32 input wide OR functions • 12 inputs • 10 bi-directional I/O • 42 AND gates – 32 logic product terms – 10 direction control terms • Programmable output polarity – Active-High or Active-Low • Security fuse • 3-State outputs • Power dissipation: 750mW (typ.) • TTL Compatible APPLICATIONS • Random logic • Code converters • Fault detectors • Function generators • Address mapping • Multiplexing PIN CONFIGURATIONS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 N Package I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 I10 VCC B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 I11 GND A Package N = Plastic Dual In-Line (300mil-wide) I0 I1 I2 I3 VCC B9 B8 NC I4 I5 I6 I7 I8 NC I9 I10 GND I11 B0 B1 B2 NC B3 B7 B6 B5 B4 NC A = Plastic Leaded Chip Carrier ORDERING INFORMATION DESCRIPTION tPD (MAX) ORDER CODE DRAWING NUMBER 24-Pin Plastic Dual In-Line 300mil-wide 15ns PLUS173BN 0410D 24-Pin Plastic Dual In-Line 300mil-wide 12ns PLUS173DN 0410D 28-Pin Plastic Leaded Chip Carrier 15ns PLUS173BA 0401F 28-Pin Plastic Leaded Chip Carrier 12ns PLUS173DA 0401F ®PAL is a registered trademark of Advanced Micro Devices Corporation. |
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