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DS20006704A-page 17

LX7220

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Center Pad Width

Contact Pad Spacing

Center Pad Length

Contact Pitch

Y3

X2

0.65

0.65

MILLIMETERS

X.XX BSC

MIN

E

MAX

3.00

Contact Pad Length (Xnn)

Contact Pad Width (Xnn)

Y1

X1

0.80

0.30

NOM

1

2

14

C1

Contact Pad Spacing

2.00

Contact Pad to Contact Pad (Xnn)

G

0.20

Thermal Via Diameter

V

0.30

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-27488 Rev A

Y4

C1

E

X1

Y2

Y1

Y

X2

ØV

C2

SILK SCREEN

Center Pad Offset

Y4

0.26

Contact Pad Length (Xnn)

Y2

1.03

G

14-Lead Very Thin Quad Flat, No Lead Package (NVC) - 2x3x1.0 mm Body [VQFN]

With 0.6 mm Exposed Pad; Microsemi Legacy Package