STM32F103C8T6 datasheet(64/67 Pages) STMICROELECTRONICS

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Package characteristics

STM32F103xx

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6.1

Thermal characteristics

The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the

following equation:

TJ = TA + (PD x ΘJA)

(1)

Where:

●

TA is the Ambient Temperature in ° C,

●

JA is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,

●

PD is the sum of PINT and PI/O (PD = PINT + PI/O),

●

PINT is the product of IDD and VDD, expressed in Watts. This is the Chip Internal Power.

PI/O represents the Power Dissipation on Input and Output Pins;

Most of the time for the application PI/O< PINT and can be neglected. On the other hand, PI/O

may be significant if the device is configured to drive continuously external modules and/or

memories.

An approximate relationship between PD and TJ (if PI/O is neglected) is given by:

PD = K / (TJ + 273 °C)

(2)

Therefore (solving equations 1 and 2):

K = PD x (TA + 273°C) + ΘJA x PD

(3)

where:

K is a constant for the particular part, which may be determined from equation (3) by

measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ

may be obtained by solving equations (1) and (2) iteratively for any value of TA.

Table 46.

Thermal characteristics

Symbol

Parameter

Value

Unit

Thermal resistance junction-ambient

LFBGA100 - 10 x 10 mm / 0.5 mm pitch

°C/W

Thermal resistance junction-ambient

LQFP100 - 14 x 14 mm / 0.5 mm pitch

Thermal Resistance Junction-Ambient

LQFP64 - 10 x 10 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LQFP48 - 7 x 7 mm / 0.5 mm pitch

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