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ABSOLUTE MAXIMUM RATINGS

(1)

THERMAL CHARACTERISTICS

(1)

ADS5474

SLAS525 – JULY 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

ADS5474IPFP

Tray, 96

ADS5474

PFP

–40

°C to +85°C

ADS5474I

PowerPAD

ADS5474IPFPR

Tape and Reel, 1000

(1)

For the most current product and ordering information see the Package Option Addendum located at the end of this document, or see

the TI web site at www.ti.com.

(2)

Thermal pad size: 9.5 mm

× 9.5 mm (minimum), 10 mm × 10 mm (maximum).

Over operating free-air temperature range, unless otherwise noted.

ADS5474

UNIT

AVDD5 to GND

6

V

Supply voltage

AVDD3 to GND

5

V

DVDD3 to GND

5

V

Analog input to GND

–0.3 to (AVDD5 + 0.3)

V

Clock input to GND

–0.3 to (AVDD5 + 0.3)

V

CLK to CLK

±2.5

V

Digital data output to GND

–0.3 to (DVDD3 + 0.3)

V

Operating temperature range

–40 to +85

°C

Maximum junction temperature

+150

°C

Storage temperature range

–65 to +150

°C

ESD, human-body model (HBM)

2

kV

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon

request.

PARAMETER

TEST CONDITIONS

TYP

UNIT

Soldered thermal pad, no airflow

23.7

(2)

Soldered thermal pad, 150-LFM airflow

17.8

°C/W

Soldered thermal pad, 250-LFM airflow

16.4

(3)

Bottom of package (thermal pad)

2.99

°C/W

(1)

Using 36 thermal vias (6

(2)

(3)

2

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