4

®

DAC7644

LINEARITY

DIFFERENTIAL

PACKAGE

SPECIFICATION

ERROR

NONLINEARITY

DRAWING

TEMPERATURE

ORDERING

TRANSPORT

PRODUCT

(LSB)

(LSB)

PACKAGE

NUMBER(1)

RANGE

NUMBER(2)

MEDIA

DAC7644E

±4

±3

48-Lead SSOP

333

–40

°C to +85°C

DAC7644E

Rails

""

"

"

"

"

DAC7644E/1K

Tape and Reel

DAC7644EB

±3

±2

48-Lead SSOP

333

–40

°C to +85°C

DAC7644EB

Rails

""

"

"

"

"

DAC7644EB/1K

Tape and Reel

NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/)

are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7644/1K” will get a single

1000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.

ABSOLUTE MAXIMUM RATINGS(1)

VCC and VDD to VSS .............................................................. –0.3V to 11V

VCC and VDD to GND ........................................................... –0.3V to 5.5V

VREFL to VSS ............................................................. –0.3V to (VCC – VSS)

VCC to VREFH ............................................................ –0.3V to (VCC – VSS)

VREFH to VREFL ......................................................... –0.3V to (VCC – VSS)

Digital Input Voltage to GND ................................... –0.3V to VDD + 0.3V

Digital Output Voltage to GND ................................. –0.3V to VDD + 0.3V

Maximum Junction Temperature ................................................... +150

°C

Operating Temperature Range ........................................ –40

°C to +85°C

Storage Temperature Range ......................................... –65

°C to +125°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

PACKAGE/ORDERING INFORMATION