TUSB4041IPAP datasheet(8/48 Pages) TI2

8 / 48 page

TUSB4041I

SLLSEK3E – JULY 2015 – REVISED SEPTEMBER 2017

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Pin Functions (continued)

I/O(1)

TYPE(1)

DESCRIPTION

NAME

NO.

TEST

This pin is reserved for factory test.

POWER AND GROUND SIGNALS

—

No connection, leave floating

VDD

—

PWR

1.1-V power rail

VDD33

—

PWR

3.3-V power rail

Thermal Pad

—

Ground. The thermal pad must be connected to ground.

(1)

Stresses beyond those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated as Recommended Operating Conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

VDD steady-state supply voltage

–0.3

1.4

VDD33 steady-state supply voltage

–0.3

3.8

Voltage

USB_VBUS pin

–0.3

1.4

XI pins

–0.3

2.45

All other pins

–0.3

3.8

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

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