TSC2014 datasheet(4/62 Pages) TI2

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TSC2014

SBAS484B – SEPTEMBER 2010 – REVISED DECEMBER 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-

maximum rated conditions for extended periods may affect device reliability.

6 Electrical Specifications

6.1 Absolute Maximum Ratings

(1)

Over operating free-air temperature range (unless otherwise noted).

MIN

MAX

UNIT

Voltage range

Analog input X+, Y+, AUX to GND

–0.4

VDD + 0.1

Analog input X–, Y– to GND

–0.4

VDD + 0.1

VDD/REF pin to GND

–0.

Digital input voltage to GND

–0.

VDD + 0.3

Digital output voltage to GND

–0.

VDD + 0.3

Operating free-air temperature range, TA

–40

°C

Storage temperature range, TSTG

–65

150

°C

Junction temperature, TJ Max

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

6.3 Thermal Information

THERMAL METRIC(1)

TSC2014

UNIT

YZG (DSBGA)

12 PINS

θJA

Junction-to-ambient thermal resistance

115

°C/W

θJCtop

Junction-to-case (top) thermal resistance

°C/W

θJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

°C/W

ψJB

Junction-to-board characterization parameter

°C/W

θJCbot

Junction-to-case (bottom) thermal resistance

—

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Power Supply, VDD/REF

1.2

3.3

3.6

Operating free-air temperature

–40

°C

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