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RP152X024X Scheda tecnica(PDF) 26 Page - Nisshinbo Micro Devices Inc. |
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RP152X024X Scheda tecnica(HTML) 26 Page - Nisshinbo Micro Devices Inc. |
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26 / 29 page ![]() PACKAGE DIMENSIONS DFN1212-6 Ver. A i 1.20 A B 0.05 X4 INDEX S 0.05 S 1 6 4 0.180.05 0.05 M AB C0.15 0.940.05 0.40 3 ※ (Unit: mm) Bottom View ※ The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. DFN1212-6 Package Dimensions |
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