POWER DISSIPATION

SOT-23-6

Ver. A

i

Power Dissipation (PD) of the package is dependent on PCB material, layout, and environmental conditions.

The following conditions are used in this measurement.

Measurement Conditions

Standard Land Pattern

Environment

Mounting on Board (Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic (Double-sided)

Board Dimensions

40 mm x 40 mm x 1.6 mm

Copper Ratio

Top-side: Approx. 50%, Back-side: Approx. 50%

Through-holes



0.5 mm x 44 pcs

Measurement Result

(Ta = 25C, Tjmax = 125C)

Standard Land Pattern

Free Air

Power Dissipation

420 mW

250 mW

Thermal Resistance



ja = (125 - 25C) / 0.42 W = 238C/W

400C/W

Power Dissipation (mW) vs. Temperature (°C)

Measurement Board Pattern

600

500

400

300

200

100

0

0

25

50

75

100

125

150

Ambient Temperature (C)

85

Free Air

On Board

250

420

IC Mount Area (Unit: mm)

40