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LMX2624PAP/EM Scheda tecnica(PDF) 85 Page - Texas Instruments |
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LMX2624PAP/EM Scheda tecnica(HTML) 85 Page - Texas Instruments |
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85 / 92 page ![]() www.ti.com PACKAGE OUTLINE C 64X 0.27 0.17 60X 0.5 PIN 1 ID (0.127) TYP 0.15 0.05 0 -7 4X 7.5 12.2 11.8 TYP 6.08 4.67 B 10.2 9.8 NOTE 3 A 10.2 9.8 NOTE 3 0.75 0.45 0.25 GAGE PLANE 1.2 MAX (1) PLASTIC QUAD FLATPACK PLASTIC QUAD FLATPACK PowerPAD TQFP - 1.2 mm max height PAP0064E 4228332/A 01/2022 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. 4. Strap features may not be present. 5. Reference JEDEC registration MS-026. PowerPAD is a trademark of Texas Instruments. TM 1 16 17 32 33 48 49 64 0.08 C A B SEE DETAIL A SEATING PLANE TYPICAL A 17 DETAIL A 0.08 C 1 SCALE 1.300 16 17 32 33 48 49 64 65 www.ti.com LMX2624-SP SNAS849B – DECEMBER 2024 – REVISED SEPTEMBER 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 85 Product Folder Links: LMX2624-SP |
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