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VT5376V032 Scheda tecnica(PDF) 28 Page - STMicroelectronics |
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VT5376V032 Scheda tecnica(HTML) 28 Page - STMicroelectronics |
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28 / 30 page ![]() Package mechanical data VT5376 28/30 Note: 1 Surface finish W1 is 0.07 Ra. 2 Ejectors are on 5.2 mm square for both top and bottom package. 3 On top package, only the pin 1 identification is not an engraved ejector. 10.1 TQFP package guidelines The IC can be exposed a maximum of two times to an IR/Convection reflow solder process having a temperature profile peak of no higher than 240 ° C. The package/chip are lead free and is ROHS compliant. For full handling guidelines please contact ST (document reference 7310263). Table 10. TQFP dimensions (mm) Reference Minimum (mm) Typical (mm) Maximum (mm) A 1.600 A1 0.050 0.150 A2 1.350 1.400 1.450 B 0.300 0.370 0.450 c 0.090 0.200 D9.000 D1 7.000 D3 5.600 e0.800 E9.000 E1 7.000 E3 5.600 L 0.450 0.600 0.750 L1 1.000 k0d 3.5d 7d W1 5.000 W2 0.650 |
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