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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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PM6675STR Scheda tecnica(PDF) 50 Page - STMicroelectronics |
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PM6675STR Scheda tecnica(HTML) 50 Page - STMicroelectronics |
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50 / 53 page  Package mechanical data PM6675S 50/53 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 18. VFQFPN-24 4 mm x 4 mm mechanical data Dim. mm. Min Typ Max A 0.80 0.90 1.00 A1 0.0 0.05 A2 0.65 0.80 D 4.00 D1 3.75 E4.00 E1 3.75 θ 12° P 0.240.420.60 e0.50 N 24.00 Nd 6.00 Ne 6.00 L 0.300.400.50 b 0.18 0.30 D2 1.95 2.10 2.25 E2 1.95 2.10 2.25 |
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