SH7708 datasheet(270/633 Pages) RENESAS

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Figure 10.21 shows the timing of the CAS-before-RAS refresh cycle.

The number of

RAS assert cycles in the refresh cycle is specified by the TRAS bits in MCR and

DCR. The specification of the RAS precharge time in the refresh cycle is determined by the

setting of the TPC bits in MCR and DCR in the same way as for normal access.

TRc

TRr1

TRr2

(Tpc)

CKIO

RD/

RAS

CASxx

CS2 or CS3

(High)

Figure 10.21 DRAM CAS-Before-RAS Refresh Cycle Timing

The self-refreshing supported by the SH7708 Series is shown in figure 10.22.

After the self-refresh is cleared, the refresh controller immediately generates a refresh request. The

RAS precharge time immediately after the end of the self-refreshing can be set by the TPC bits in

MCR and DCR.

DRAMs include low-power products (L versions) with a long refresh cycle time (for example, the

L version of the HM51W4160AL has a refresh cycle of 1024 cycles/128 ms compared with 1024

cycles/16 ms for the normal version). With these DRAMs, however, the same refresh cycle as the

normal version is requested only when refreshing immediately after self-refreshing. Therefore, to

ensure efficient DRAM refreshing, an overflow interrupt is generated and the refresh cycle is

restored to its proper value. This occurs after the necessary CAS-before-RAS refreshing has been

performed following self-refreshing of an L-version DRAM, using RFCR and the OVF, OVIE,

and LMTS bits in RTCSR. The procedure is as follows.

SH7708 Scheda tecnica(PDF) 270 Page - Renesas Technology Corp