THS4031, THS4032

100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS

SLOS224C – JULY 1999 – REVISED APRIL 2000

3

POST OFFICE BOX 655303

functional block diagram

OUT

8

6

1

IN–

IN+

2

3

Null

–

+

1OUT

1IN–

1IN+

VCC

2OUT

2IN–

2IN+

–VCC

8

6

1

2

3

5

7

4

–

+

–

+

Figure 1. THS4031 – Single Channel

Figure 2. THS4032 – Dual Channel

33 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I-suffix

–40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M-suffix

–55

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package

300

°C

. . . . . . . . . . . . . . . . . . . .

Case temperature for 60 seconds, FK package

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

θJA

θJC

TA = 25°C

PACKAGE

JA

(

°C/W)

JC

(

°C/W)

A

POWER RATING

D

167‡

38.3

740 mW

DGN§

58.4

4.7

2.14 W

JG

119

28

1050 mW

FK

87.7

20

1375 mW

‡ This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed

High-K test PCB, the

θJA is 95°C/W with a power rating at TA = 25°C of 1.32 W.

§ This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in.

× 3-in.

PC. For further information, refer to

Application Information section of this data sheet.