THS4031 datasheet(30/38 Pages) TI

30 / 38 page

THS4031, THS4032

100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS

SLOS224C – JULY 1999 – REVISED APRIL 2000

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

general PowerPAD

™ design considerations (continued)

The actual thermal performance achieved with the THS403xDGN in its PowerPAD

™ package depends on the

application. In the example above, if the size of the internal ground plane is approximately 3 inches

× 3 inches,

then the expected thermal coefficient,

θJA, is about 58.4_C/W. For comparison, the non-PowerPAD™ version

of the THS403x IC (SOIC) is shown. For a given

θJA, the maximum power dissipation is shown in Figure 56 and

is calculated by the following formula:

D +

MAX

–T

Where:

= Maximum power dissipation of THS403x IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case

θCA = Thermal coefficient from case to ambient air (°C/W)

DGN Package

θJA = 58.4°C/W

2 oz. Trace And Copper Pad

With Solder

DGN Package

θJA = 158°C/W

2 oz. Trace And

Copper Pad

Without Solder

SOIC Package

High-K Test PCB

θJA = 98°C/W

TJ = 150°C

SOIC Package

Low-K Test PCB

θJA = 167°C/W

1.5

–40

–20

2.5

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

3.5

100

0.5

TA – Free-Air Temperature – °C

NOTE A: Results are with no air flow and PCB size = 3”

× 3”

Figure 56. Maximum Power Dissipation vs Free-Air Temperature

More complete details of the PowerPAD

™ installation process and thermal management techniques can be

found in the Texas Instruments technical brief,

PowerPAD

™ Thermally Enhanced Package. This document can

be found at the TI web site (www.ti.com) by searching on the key word PowerPAD

™. The document can also

be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.

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