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AS4DDR232M72PBG-3/IT Scheda tecnica(PDF) 10 Page - Austin Semiconductor |
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AS4DDR232M72PBG-3/IT Scheda tecnica(HTML) 10 Page - Austin Semiconductor |
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10 / 28 page ![]() iiiiiPEM PEM PEM PEM PEM 2.4 G 2.4 G 2.4 G 2.4 G 2.4 Gbbbbb SDRAM-DDR2 SDRAM-DDR2 SDRAM-DDR2 SDRAM-DDR2 SDRAM-DDR2 AS4DDR232M72PBG AS4DDR232M72PBG Rev. 2.0 5/07 Austin Semiconductor, Inc. ● Austin, Texas ● 512.339.1188 ● www.austinsemiconductor.com 10 Austin Semiconductor, Inc. CAS LATENCY (CL) The CAS latency (CL) is defined by bits M4-M6, as shown in Figure 5. CL is the delay, in clock cycles, between the registration of a READ command and the availability of the first bit of output data. The CL can be set to 3, 4, 5, or 6 clocks, depending on the speed grade option being used. DDR2 SDRAM does not support any half-clock latencies. Reserved states should not be used as unknown operation or incompatibility with future versions may result. DDR2 SDRAM also supports a feature called posted CAS additive latency (AL). This feature allows the READ command to be issued prior to tRCD (MIN) by delaying the internal command to the DDR2 SDRAM by AL clocks. Examples of CL = 3 and CL = 4 are shown in Figure 6; both assume AL = 0. If a READ command is registered at clock edge n, and the CL is m clocks, the data will be available nominally coincident with clock edge n+m (this assumes AL = 0). FIGURE 6 - CAS LATENCY (CL) T0 T1 T2 T3 T4 T5 T6 CK# CK COMMAND DQS, DQS# DQ CK# CK COMMAND DQS, DQS# DQ Burst length = 4 Posted CAS# additive latency (AL) = 0 Shown with nominal t AC, tDQSCK, and tDQSQ DOUT n + 3 DOUT n + 2 DOUT n + 1 CL = 3 (AL = 0) READ NOP NOP NOP DOUT n NOP NOP NOP DOUT n + 3 DOUT n + 2 DOUT n + 1 CL = 4 (AL = 0) READ T0 T1 T2 NOP NOP NOP DOUT n T3 T4 T5 NOP NOP T6 NOP TRANSITIONING DATA DON’T CARE |
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