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AS4DDR232M72PBG-3/IT Scheda tecnica(PDF) 10 Page - Austin Semiconductor

Il numero della parte AS4DDR232M72PBG-3/IT
Spiegazioni elettronici  32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit
PDF  28 Pages
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Produttore elettronici  AUSTIN [Austin Semiconductor]
Homepage  http://www.austinsemiconductor.com
Logo AUSTIN - Austin Semiconductor

AS4DDR232M72PBG-3/IT Scheda tecnica(HTML) 10 Page - Austin Semiconductor

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2.4 G
2.4 G
2.4 G
2.4 G
2.4 Gbbbbb SDRAM-DDR2
SDRAM-DDR2
SDRAM-DDR2
SDRAM-DDR2
SDRAM-DDR2
AS4DDR232M72PBG
AS4DDR232M72PBG
Rev. 2.0 5/07
Austin Semiconductor, Inc. Austin, Texas 512.339.1188 www.austinsemiconductor.com
10
Austin Semiconductor, Inc.
CAS LATENCY (CL)
The CAS latency (CL) is defined by bits M4-M6, as shown
in Figure 5. CL is the delay, in clock cycles, between the
registration of a READ command and the availability of the
first bit of output data. The CL can be set to 3, 4, 5, or 6
clocks, depending on the speed grade option being used.
DDR2 SDRAM does not support any half-clock latencies.
Reserved states should not be used as unknown operation
or incompatibility with future versions may result.
DDR2 SDRAM also supports a feature called posted CAS
additive latency (AL). This feature allows the READ command
to be issued prior to tRCD (MIN) by delaying the
internal command to the DDR2 SDRAM by AL clocks.
Examples of CL = 3 and CL = 4 are shown in Figure 6; both
assume AL = 0. If a READ command is registered at clock
edge n, and the CL is m clocks, the data will be available
nominally coincident with clock edge n+m (this assumes
AL = 0).
FIGURE 6 - CAS LATENCY (CL)
T0
T1
T2
T3
T4
T5
T6
CK#
CK
COMMAND
DQS, DQS#
DQ
CK#
CK
COMMAND
DQS, DQS#
DQ
Burst length = 4
Posted CAS# additive latency (AL) = 0
Shown with nominal
t AC, tDQSCK, and tDQSQ
DOUT
n + 3
DOUT
n + 2
DOUT
n + 1
CL = 3 (AL = 0)
READ
NOP
NOP
NOP
DOUT
n
NOP
NOP
NOP
DOUT
n + 3
DOUT
n + 2
DOUT
n + 1
CL = 4 (AL = 0)
READ
T0
T1
T2
NOP
NOP
NOP
DOUT
n
T3
T4
T5
NOP
NOP
T6
NOP
TRANSITIONING DATA
DON’T CARE



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