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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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CPC7593MATR Scheda tecnica(PDF) 22 Page - Clare, Inc. |
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CPC7593MATR Scheda tecnica(HTML) 22 Page - Clare, Inc. |
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22 / 24 page  CPC7593 22 www.clare.com R04 3.1.3 CPC7593M NOTE: As the metallic pad on the bottom of the DFN package is connected to the substrate of the die, Clare recommends that no printed circuit board traces cross this area to avoid potential shorting issues. 28-Lead DFN Package Recommended PCB Land Pattern Dimensions mm (inches) 7.0 (0.276) 11.0 (0.433) 7.5±0.05 (0.296±0.002) 5.0±0.05 (0.197±0.002) 0.75 (0.030) 0.33 +0.07,-0.05 (0.013 +0.003, -0.002) 0.55±0.10 (0.022±0.004) Bottom side metallic pad Pin 1 0.90±0.10 (0.036 ±0.004) 0.02 +0.03, -0.02 (0.001 +0.0012, -0.001) Seating Plane 0.20 (0.008) Pin 1 6.70 (0.264) 0.75 (0.03) 0.35 (0.016) 1.05 (0.045) |
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