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CPC7593MATR Scheda tecnica(PDF) 23 Page - Clare, Inc. |
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CPC7593MATR Scheda tecnica(HTML) 23 Page - Clare, Inc. |
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23 / 24 page ![]() CPC7593 R04 www.clare.com 23 3.2 Tape and Reel Specifications 3.2.1 CPC7593Z: 20-Pin SOIC 3.2.2 CPC7593B: 28-Pin SOIC 3.2.3 CPC7593M: 28-Pin DFN Top Cover Tape Thickness 0.102 MAX (0.004 MAX) 330.2 DIA. (13.00 DIA) Embossed Carrier Embossment K 0=3.20 0.15 (0.13 0.01) + + K 1=2.60 0.15 (0.10 0.01) + + P=12.00 (0.47) A 0=10.75 0.15 (0.42 0.01) + + B 0=13.40 0.15 (0.53 0.01) + + W=24.00 0.3 (0.94 0.01) + + Dimensions mm (inches) A 0=10.75 (0.42) B 0=18.50 (0.73) W=24.00±0.3 (0.94±0.01) K 1=2.60 (0.10) K 0=3.20 (0.13) P=12.00 (0.47) Top Cover Tape Thickness 0.102 MAX (0.004 MAX) 330.2 DIA. (13.00 DIA) Embossed Carrier Embossment Dimensions mm (inches) Top Cover Tape Thickness 0.102 MAX (0.004 MAX) 330.2 DIA. (13.00 DIA) Embossed Carrier Embossment K 0=1.35 (0.05) P=12.00 (0.47) A 0=7.35 (0.29) B 0=11.35 (0.45) W=24.00 0.3 (0.94 0.01) + + Dimensions mm (inches) |
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