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HT1621 Scheda tecnica(PDF) 3 Page - Holtek Semiconductor Inc |
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HT1621 Scheda tecnica(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 21 page ![]() Pad Assignment Chip size: 82 ´ 83 (mil) 2 Bump height: 18 mm ± 3mm Min. Bump spacing: 23.02 mm Bump size: 76 ´ 76mm 2 * The IC substrate should be connected to VDD in the PCB layout artwork. HT1621 Rev. 2.60 3 October 28, 2009 PATENTED I R Q ( 0 , 0 ) R D W R D A T A V S S O S C O O S C I V L C D V D D S E G 2 8 S E G 2 7 S E G 2 6 S E G 2 5 S E G 2 4 S E G 2 3 S E G 2 2 S E G 2 1 S E G 2 0 S E G 1 9 S E G 1 8 S E G 1 7 S E G 1 6 1 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 3 4 5 6 7 8 9 1 0 |
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