PA241

2

PA241U

P r o d u c t I n n o v a t i o n F r o m

ABSOLUTEMAXIMUMRATINGS

PA241CE

PA241DF

PA241CEA

PA241DFA

SUPPLY VOLTAGE, +V

350V

350V

OUTPUT CURRENT, continuous within SOA

60 mA

60 mA

OUTPUT CURRENT, peak

120 mA

120 mA

POWER DISSIPATION, continuous @ T

12W

12W

INPUT VOLTAGE, differential

±16 V

±16 V

INPUT VOLTAGE, common mode

±V

S

±V

S

TEMPERATURE, pin solder – 10 sec

300°C

220°C

150°C

150°C

TEMPERATURE, storage

–65 to +150°C

–65 to +150°C

TEMPERATURE RANGE, powered (case)

–40 to +125°C

–40 to +125°C

CAUTION

The PA241 is constructed from MOSFET transistors. ESD handling procedures must be observed.

PA241CE, PA241DF

PA241CEA

PARAMETER

MIN

TYP

MAX

MIN

TYP

MAX

UNITS

INPUT

OFFSET VOLTAGE, initial

25

40

15

30

mV

25° to 85°C

100

250

*

*

µV/°C

-25° to 25°C

270

500

*

*

µV/°C

OFFSET VOLTAGE, vs supply

3

*

µV/V

OFFSET VOLTAGE, vs time

70

130

*

*

µV/kh

5/50

50/200

*

*

pA

BIAS CURRENT, vs supply

0.2/2

*

pA/V

2.5/50

50/200

*

*

pA

INPUT IMPEDANCE, DC

*

INPUT CAPACITANCE

6

*

pF

COMMON MODE, voltage range

+V

*

V

COMMON MODE, voltage range

-V

*

V

COMMON MODE REJECTION, DC

V

84

94

*

*

dB

NOISE, broad band

10kHz BW, R

50

*

µV RMS

NOISE, low frequency

1-10 Hz

125

*

µV p-p

GAIN

OPEN LOOP at 15Hz

R

90

96

*

*

dB

BANDWIDTH, gain bandwidth product

3

*

MHz

POWER BANDWIDTH

280V p-p

30

*

kHz

OUTPUT

VOLTAGE SWING

I

±V

±V

±V

±V

V

120

*

mA

CURRENT, continuous

60

*

mA

SETTLING TIME to .1%

10V step, A

2

*

µs

SLEW RATE

C

30

*

V/µs

R

150

*

Ω

R

5

*

Ω

POWER SUPPLY

VOLTAGE

±50

±150

±175

*

*

*

V

CURRENT, quiescent

2.2

2.5

*

2.3

mA

THERMAL

PA241CE RESISTANCE, AC junction to case F > 60Hz

5.4

6.5

*

*

°C/W

PA241DF RESISTANCE, AC junction to case

F > 60Hz

6

7

*

*

°C/W

PA241CE RESISTANCE, DC junction to case F < 60Hz

9

10.4

*

*

°C/W

PA241DF RESISTANCE, DC junction to case F < 60Hz

9

11

*

*

°C/W

PA241CE RESISTANCE, junction to air

Full temperature range

30

*

°C/W

Full temperature range

25

*

°C/W

TEMPERATURE RANGE, case

Meets full range spec's

–25

+85

*

*

°C

SPECIFICATIONS

NOTES:

*

"A" specification is the same as the non "A" specification.

1.

Unless otherwise noted T

rating.

2.

Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation

to achieve high MTTF. For guidance, refer to heatsink data sheet.

3.

Sample tested by wafer to 95%.

4.

Guaranteed but not tested.

5.

The selected value of R

6.

Specifications separated by / indicate values for the PA241CE and PA241DF respectively.

7.

Rating applies with solder connection of heatslug to a minimum 1 square inch foil area of the printed circuit board.