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Datasheet

Boxed Processor Specifications

7.3

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the

boxed processor.

7.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the

processor's temperature specification is also a function of the thermal design of the

entire system, and ultimately the responsibility of the system integrator. The processor

temperature specification is in Chapter 5. The boxed processor fan heatsink is able to

keep the processor temperature within the specifications in chassis that provide good

thermal management. For the boxed processor fan heatsink to operate properly, it is

critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan

heatsink is into the center and out of the sides of the fan heatsink. Airspace is required

around the fan to ensure that the airflow through the fan heatsink is not blocked.

Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases

fan life. Figure 23 and Figure 24 illustrate an acceptable airspace clearance for the fan

heatsink. The air temperature entering the fan should be kept below 38 °C. A

Thermally Advantaged Chassis with an Air Guide 1.1 is recommended to meet the

38 °C requirement. Again, meeting the processor's temperature specification is the

responsibility of the system integrator.

Note:

The processor fan is the primary source of airflow for cooling the VCC voltage regulator.

Dedicated voltage regulator cooling components may be necessary if the selected fan is

not capable of keeping regulator components below maximum rated temperatures.

Figure 22.

Baseboard Power Header Placement Relative to Processor Socket

R110

[4.33]

641 Scheda tecnica(PDF) 93 Page - Intel Corporation