641 datasheet(98/106 Pages) INTEL

98 / 106 page

Balanced Technology Extended (BTX) Boxed Processor Specifications

Datasheet

NOTE: Diagram does not show the attached hardware for the clip design and is provided only as a

mechanical representation.

8.1.2

Boxed Processor Thermal Module Assembly Weight

The boxed processor thermal module assembly for Type I BTX will not weigh more than

1200 grams. The boxed processor thermal module assembly for Type II BTX will not

weigh more than 1200 grams. See Chapter 5 and the appropriate processor Thermal

and Mechanical Design Guidelines (see Section 1.2) for details on the processor weight

and thermal module assembly requirements.

8.1.3

Boxed Processor Support and Retention Module (SRM)

The boxed processor TMA requires an SRM assembly provided by the chassis

manufacturer. The SRM provides the attach points for the TMA and provides structural

support for the board by distributing the shock and vibration loads to the chassis base

pan. The boxed processor TMA will ship with the heatsink attach clip assembly, duct

and screws for attachment. The SRM must be supplied by the chassis hardware vendor.

See the Support and Retention Module (SRM) External Design Requirements

Figure 28.

Requirements for the Balanced Technology Extended (BTX) Type II Keep-out

Volume

641 Scheda tecnica(PDF) 98 Page - Intel Corporation