335 datasheet(75/82 Pages) INTEL

75 / 82 page

Datasheet

Boxed Processor Specifications

7.1.2

Boxed Processor Fan Heatsink Weight

The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5 and the

Intel® Pentium 4 Processor on 90 nm Process Thermal Design Guidelines for details on the

processor weight and heatsink requirements.

Note:

The processor retention mechanism based on the Intel reference design should be used, to ensure

compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The

heatsink attach clip assembly is latched to the retention tab features at each corner of the retention

mechanism.

The target load applied by the clips to the processor heat spreader for Intel's reference design is

75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a

bow or bend in the board due to this compressive load on the processor package and the socket.

The level of bow or bend depends on the motherboard material properties and component layout.

Any additional board stiffening devices (such as plates) are not necessary and should not be used

along with the reference mechanical components and boxed processor. Using such devices

increases the compressive load on the processor package and socket, likely beyond the maximum

load that is specified for those components. See the Intel® Pentium 4 Processor on 90 nm Process

Thermal Design Guidelines for details on the Intel reference design.

Chassis that have adequate clearance between the motherboard and chassis wall (minimum

0.250 inch) should be selected to ensure the board's underside bend does not contact the chassis.

7.1.3

Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly

The boxed processor thermal solution requires a processor retention mechanism and a heatsink

attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. The boxed

processor will not ship with retention mechanisms but will ship with the heatsink attach clip

assembly. Baseboards designed for use by system integrators should include the retention

mechanism that supports the boxed Celeron D processor. Baseboard documentation should include

appropriate retention mechanism installation instructions.

335 Scheda tecnica(PDF) 75 Page - Intel Corporation