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335 Scheda tecnica(PDF) 35 Page - Intel Corporation

Il numero della parte 335
Spiegazioni elettronici  Celeron D Processor
PDF  82 Pages
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Produttore elettronici  INTEL [Intel Corporation]
Homepage  http://www.intel.com
Logo INTEL - Intel Corporation

335 Scheda tecnica(HTML) 35 Page - Intel Corporation

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35
Package Mechanical Specifications
3.4
Package Handling Guidelines
Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
3.5
Package Insertion Specifications
The Celeron D processor can be inserted into and removed from a mPGA478B socket 15 times.
The socket should meet the mPGA478B requirements detailed in the mPGA479, mPGA478A,
mPGA478B, mPGA478C, and mPGA476 Socket Design Guidelines.
3.6
Processor Mass Specification
The typical mass of the Celeron D processor is 19 g [0.67 oz]. This mass [weight] includes all the
components that are included in the package.
3.7
Processor Materials
Table 3-3 lists some of the package components and associated materials.
Table 3-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N [80 lbf]
1,2
NOTES:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
These guidelines are based on limited testing for design characterization.
Tensile
156 N [35 lbf]
2,3
3.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
Torque
8 N-m [70 lbf-in]
2,4
4.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top sur-
face.
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Pins
Gold Plated Copper



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