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MPC5602DXLL Scheda tecnica(PDF) 25 Page - Freescale Semiconductor, Inc

Il numero della parte MPC5602DXLL
Spiegazioni elettronici  Up to 256 KB on-chip Code Flash supported with Flash controller and ECC
PDF  77 Pages
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Produttore elettronici  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC5602DXLL Scheda tecnica(HTML) 25 Page - Freescale Semiconductor, Inc

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Electrical characteristics
MPC5602D Microcontroller Data Sheet, Rev. 3.1
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
25
4.6.2
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:
TJ = TA + (PD x RJA)
Eqn. 1
Where:
TA is the ambient temperature in °C.
RJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PI/O (PD = PINT + PI/O).
PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power.
PI/O represents the power dissipation on input and output pins; user determined.
Most of the time for the applications, PI/O< PINT and may be neglected. On the other hand, PI/O may be significant, if the device
is configured to continuously drive external modules and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273 °C)
Eqn. 2
Therefore, solving equations 1 and 2:
K = PD x (TA + 273 °C) + RJA x PD
2
Eqn. 3
Where:
K is a constant for the particular part, which may be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ may be obtained by solving equations 1 and 2
iteratively for any value of TA.
4.7
I/O pad electrical characteristics
4.7.1
I/O pad types
The device provides four main I/O pad types depending on the associated alternate functions:
Slow pads—These pads are the most common pads, providing a good compromise between transition time and low
electromagnetic emission.
Medium pads—These pads provide transition fast enough for the serial communication channels with controlled
current to reduce electromagnetic emission.
Input only pads—These pads are associated to ADC channels (ADC_P[X]) providing low input leakage.
Medium pads can use slow configuration to reduce electromagnetic emission except for PC[1], that is medium only, at the cost
of reducing AC performance.



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