IXDI614PI datasheet(12/14 Pages) CLARE

12 / 14 page

IXD_614

www.clare.com

R02

5.4 Mechanical Dimensions

5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back)

5.4.2 SI Package Tape & Reel Information

Recommended PCB Land Pattern

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

NOTES:

1. Molded package conforms to JEDEC standard configuration

MS-012 variation BA.

2. The exposed metal pad on the back of the SI package should

be connected to GND. It is not suitable for carrying

current.

1.30 / 1.75

(0.051 / 0.069)

0.03 / 0.10

(0.001 / 0.004)

4.80 / 5.00

(0.190 / 0.197)

PIN 1

0.31 / 0.51

(0.012 / 0.020)

5.80 / 6.20

(0.228 / 0.244)

3.80 / 4.00

(0.150 / 0.157)

1.27 BSC

(0.05 BSC)

0.40 / 1.27

(0.016 / 0.050)

0.10 / 0.25

(0.004 / 0.010)

0.25 / 0.50 x45º

(0.010 / 0.020 x45º)

0º / 8º

2.29 / 2.79

(0.090 / 0.110)

3.30 / 3.81

(0.130 / 0.150)

1.27

(0.050)

5.40

(0.209)

1.55

(0.061)

0.60

(0.024)

2.75

(0.108)

3.80

(0.150)

NOTES:

1. A

0 & B0 measured at 0.3mm above base of pocket.

2. 10 pitches cumulative tol. ± 0.2mm

3. ( ) Reference dimensions only.

4. Unless otherwise specified, all dimensions in millimeters.

0=2.30 ± 0.10

0=5.20 ± 0.10

R0.50 TYP

8.00 ± 0.10

2.00 ± 0.10

4.00 ± 0.10 See Note #2

12.00 ± 0.30

5.50 ± 0.10

1.75 ± 0.10

∅1.50 (MIN)

∅1.55 ± 0.05

1.80 ± 0.10

(3.40)

0.30 ± 0.05

(70º)

0=6.40 ± 0.10

(4.70)

(1.20)

SECTION A-A

SECTION B-B

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

IXDI614PI Scheda tecnica(PDF) 12 Page - Clare, Inc.

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