IXD_614

14

www.clare.com

R02

5.4.5 PI (8-Pin DIP)

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

NOTE: Molded package conforms to JEDEC standard configuration

MS-001 variation BA.

PC Board Pattern

7.62 / 10.92

(0.300 / 0.430)

7.62 BSC

(0.300 BSC)

0.20 / 0.38

(0.008 / 0.015)

7.37 / 8.26

(0.290 / 0.325)

0.38 / 0.58

(0.015 / 0.023)

1.14 / 1.65

(0.045 / 0.065)

0.38 / 1.02

(0.015 / 0.040)

3.05 / 3.81

(0.120 / 0.150)

3.43 / 4.70

(0.135 / 0.185)

3.18 / 3.81

(0.125 / 0.150)

8-0.900 DIA.

(8-0.035 DIA.)

7.50

(0.295)

2.540

(0.100)

9.02 / 10.16

(0.355 / 0.400)

6.10 / 6.86

(0.240 / 0.270)

2.540 BSC

(0.100 BSC)

1.40

(0.055)

For additional information please visit our website at: www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and

product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,

Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for

a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental

damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-IXD_614-R02

©Copyright 2011, Clare, Inc.

All rights reserved. Printed in USA.

8/16/2011