| Motore di ricerca datesheet componenti elettronici |
|
CXG1108K Scheda tecnica(PDF) 6 Page - Sony Corporation |
|
|
|||||||||||||||||||||||||||||
CXG1108K Scheda tecnica(HTML) 6 Page - Sony Corporation |
|
6 / 6 page ![]() – 6 – CXG1108K Sony Corporation Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL TERMINAL TREATMENT TERMINAL MATERIAL PACKAGE MASS CERAMIC SUBSTRATE NICKEL PLATING PACKAGE STRUCTURE GOLD PLATING 8PIN LCC (Ceramic) 6 4 1 7 ∗ 6.2 ± 0.3 3.8 0.9 1.6 1.9MAX X R0.2 DETAIL Y-Y DETAIL X PIN 1 INDEX 6.0 3 8 SOLDERING POINT 5 2 0.15 SOLDERING POINT COAT TERMINAL Y Y R0.2 C0.1 0.15 0.1 S S COAT TERMINAL LCC-8C-601 1.7 0.8g 0.6 ± 0.2 Dimension " ∗"dose not inculude cutting burr. |
|
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |