ADP1752ACPZ-2.5-R7 datasheet(17/20 Pages) AD

17 / 20 page

Data Sheet

ADP1752/ADP1753

Rev. E | Page 17 of 20

In cases where the board temperature is known, the thermal

characterization parameter, ΨJB, can be used to estimate the

junction temperature rise. Maximum junction temperature (TJ)

is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(7)

Figure 42 through Figure 45 show junction temperature calcula-

tions for different board temperatures, load currents, VIN to

VOUT differentials, and areas of PCB copper.

140

120

100

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

MAX JUNCTION

TEMPERATURE

LOAD = 800mA

LOAD = 100mA

LOAD = 50mA

LOAD = 10mA

LOAD = 400mA

LOAD = 200mA

Figure 42. 500 mm2 of PCB Copper, TB = 25°C, LFCSP

140

120

100

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

MAX JUNCTION

TEMPERATURE

LOAD = 800mA

LOAD = 400mA

LOAD = 200mA

LOAD = 100mA

LOAD = 50mA

LOAD = 10mA

Figure 43. 500 mm2 of PCB Copper, TB = 50°C, LFCSP

140

120

100

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

MAX JUNCTION

TEMPERATURE

LOAD = 800mA

LOAD = 400mA

LOAD = 200mA

LOAD = 100mA

LOAD = 50mA

LOAD = 10mA

Figure 44. 1000 mm2 of PCB Copper, TB = 25°C, LFCSP

140

120

100

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

MAX JUNCTION

TEMPERATURE

LOAD = 800mA

LOAD = 400mA

LOAD = 200mA

LOAD = 100mA

LOAD = 50mA

LOAD = 10mA

Figure 45. 1000 mm2 of PCB Copper, TB = 50°C, LFCSP

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