Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

MIC5166 Scheda tecnica(PDF) 13 Page - Micrel Semiconductor

Il numero della parte MIC5166
Spiegazioni elettronici  3A High-Speed Low VIN DDR Terminator
PDF  25 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Produttore elettronici  MICREL [Micrel Semiconductor]
Homepage  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC5166 Scheda tecnica(HTML) 13 Page - Micrel Semiconductor

Back Button MIC5166 Datasheet HTML 9Page - Micrel Semiconductor MIC5166 Datasheet HTML 10Page - Micrel Semiconductor MIC5166 Datasheet HTML 11Page - Micrel Semiconductor MIC5166 Datasheet HTML 12Page - Micrel Semiconductor MIC5166 Datasheet HTML 13Page - Micrel Semiconductor MIC5166 Datasheet HTML 14Page - Micrel Semiconductor MIC5166 Datasheet HTML 15Page - Micrel Semiconductor MIC5166 Datasheet HTML 16Page - Micrel Semiconductor MIC5166 Datasheet HTML 17Page - Micrel Semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 13 / 25 page
background image
Micrel, Inc.
MIC5166
June 2012
13
M9999-060612-A
Power Good (PG)
The power-good (PG) output provides an under and over
voltage fault flag for the VTT output. The PG output
remains high as long as VTT is within ±10% range of VREF
and goes low if the output moves beyond this range.
Figure 3. Power Good Threshold
The PG has an open-drain output. A pull-up resistor
must be connected to VIBIAS, VIN or an external source.
The external source voltage must not exceed the
maximum rating of the pin. The PG pin can be
connected to another regulator’s enable pin for
sequencing of the outputs.
VBIAS Requirement
A 1µF ceramic input capacitor is required on VBIAS pin.
To achieve the ultra-fast transient response, the
MIC5166 uses an all N-channel power output stage as
shown in the Functional Diagram. The high-side N-
channel MOSFET requires the VBIAS voltage to be 2.2V
higher than the VTT to be able to fully enhance the high-
side MOSFET.
VIN Requirement
VIN is used to supply the rail voltage for the high-side N-
channel power output stage. It is normally connected to
VDDQ, but it can be connected to a lower voltage to
reduce power dissipation. In this case, the input voltage
must be higher than the VTT voltage to ensure that the
output stage is not operating in dropout.
Component Selection
Input Capacitor
A 10µF ceramic input capacitor is all that is required for
most applications if it is close to a bulk capacitance.
The input capacitor must be placed on the same side of
the board and next to the MIC5166 to minimize the
dropout voltage and voltage ringing during transient and
short circuit conditions. It is also recommended that each
capacitor to be connected to the PGND directly, not
through vias. X7R or X5R dielectric ceramic capacitors
are recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60% respectively over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric, the value must be much higher than
an X7R ceramic.
Output Capacitor
As part of the frequency compensation, the MIC5166
requires two 10µF ceramic output capacitors for best
transient performance. To improve transient response,
any other type of capacitor can be placed in parallel as
long as the two 10µF ceramic output capacitors are
placed next to the MIC5166.
The output capacitor type and placement criteria are the
same as the input capacitor. See the input capacitor
section for a detailed description.
Thermal Considerations
The MIC5166 is packaged in the 3mm x 3mm MLF
®, a
package that has excellent thermal performance. This
maximizes heat transfer from the junction to the exposed
pad (ePad) which connects to the ground plane. The
size of the ground plane attached to the exposed pad
determines the overall thermal resistance from the
junction to the ambient air surrounding the printed circuit
board.
Thermal Design
The most complicated design parameters to consider
are thermal characteristics. Thermal design requires the
following application-specific parameters:
Maximum ambient temperature (TA)
Output current (IOUT)
Output voltage (VOUT)
Input voltage (VIN)
Ground current (IGND)



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25


Scheda tecnica Scarica

Go To PDF Page


Link URL



Lei ha avuto il aiuto da alldatasheet?  [ DONATE ] 

Di alldatasheet   |   Richest di pubblicita   |   contatti   |   Privacy Policy   |   Collegamento alla scheda tecnica    |   scambio Link   |   Ricerca produttore
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com