ADCLK914BCPZ-R7 datasheet(5/12 Pages) AD

5 / 12 page

ADCLK914

Rev. A | Page 5 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (VCC to GND)

6.0 V

Input Voltage

−0.5 V to VCC + 0.5 V

Maximum Output Voltage

VCC + 0.5 V

Minimum Output Voltage

VEE − 0.5 V

Input Termination

±2 V

Voltage Reference

VCC − VEE

Operating Temperature Range, Ambient

−40°C to +125°C

Operating Temperature, Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL PERFORMANCE

The ADCLK914 is specified for a case temperature (TCASE). To

ensure that TCASE is not exceeded, use an airflow source.

To determine the junction temperature on the application PCB

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer at

top center of package.

is determined by the values listed in Table 3.

PD is the power dissipation.

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order

approximation of TJ by the equation

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJB are provided for package comparison and PCB

design considerations.

Table 3. Thermal Parameters for ADCLK914 16-Lead LFCSP

Symbol

Description1

Value

Units

Junction-to-ambient thermal

resistance, 0.0 meters per sec air

flow per JEDEC JESD51-2 (still air)

78.4

°C/W

JMA

Junction-to-ambient thermal

resistance, 1.0 meter per sec air flow

per JEDEC JESD51-6 (moving air)

68.5

°C/W

JMA

Junction-to-ambient thermal

resistance, 2.5 m/s air flow per

JEDEC JESD51-6 (moving air)

61.4

°C/W

Junction-to-board thermal

resistance, 1.0 meter per sec air flow

per JEDEC JESD51-8 (moving air)

48.8

°C/W

Junction-to-case thermal resistance

(die-to-heatsink) per MIL-Std 883,

Method 1012.1

1.5

°C/W

Junction-to-top-of-package

characterization parameter, 0

meters per sec air flow per JEDEC

JESD51-2 (still air)

2.0

°C/W

1 Descriptions based on using a 2s2p test board.

ESD CAUTION

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