Notice

GCM18

GCM21

GCM31

1.6g0.8

2.0g1.25

3.2g1.6

0.6 to 1.0

1.0 to 1.2

2.2 to 2.6

0.8 to 0.9

0.9 to 1.0

1.0 to 1.1

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

(in mm)

Part Number

Dimensions

Chip (LgW)

a

b

c

Table 1 Flow Soldering Method

GCM03

GCM15

GCM18

GCM21

GCM31

GCM32

0.6g0.3

1.0g0.5

1.6g0.8

2.0g1.25

3.2g1.6

3.2g2.5

0.2 to 0.3

0.3 to 0.5

0.6 to 0.8

1.0 to 1.2

2.2 to 2.4

2.0 to 2.4

0.2 to 0.35

0.35 to 0.45

0.6 to 0.7

0.6 to 0.7

0.8 to 0.9

1.0 to 1.2

0.2 to 0.4

0.4 to 0.6

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

1.8 to 2.3

(in mm)

Part Number

Dimensions

Chip (LgW)

a

b

c

Table 2 Reflow Soldering Method

Chip Capacitor

Continued from the preceding page.

Continued on the following page.

2. Land Dimensions

2-1. Chip capacitor can be cracked due to the stress of

PCB bending / etc if the land area is larger than

needed and has an excess amount of solder.

Please refer to the land dimensions in table 1 for flow

soldering, table 2 for reflow soldering.

Please confirm the suitable land dimension by

evaluating of the actual SET / PCB.

Solder Resist

a

b

c

Land

2. Adhesive Application

1. Thin or insufficient adhesive can cause the chips to

loosen or become disconnected during flow soldering.

The amount of adhesive must be more than dimension c,

shown in the drawing at right, to obtain the correct

bonding strength.

The chip's electrode thickness and land thickness must

also be taken into consideration.

2. Low viscosity adhesive can cause chips to slip after

mounting. The adhesive must have a viscosity of

°C).

3. Adhesive Coverage

Land

Adhesive

Board

Chip Capacitor

a

b

c

c=50 to 105

µm

b=30 to 35

µm

a=20 to 70

µm

GCM18

GCM21

GCM31

0.05mg min.

0.1mg min.

0.15mg min.

Part Number

Adhesive Coverage*

*Nominal Value

3. Adhesive Curing

1. Insufficient curing of the adhesive can cause chips to

disconnect during flow soldering and causes deterioration

in the insulation resistance between the outer electrodes

due to moisture absorption.

Control curing temperature and time in order to prevent

insufficient hardening.

Notice (Soldering and Mounting)

36

1

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C03E.pdf

10.5.20