Notice

1. Please evaluate a capacitor by actual cleaning equipment

and condition surely for confirming the quality and select

the applicable solvent.

2. Unsuitable cleaning solvent may leave residual flux, other

foreign substances, causing deterioration of electrical

characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or

insufficient) may result in the deterioration of the

performance of the capacitors.

6. Washing

Continued from the preceding page.

4. Flux Application

1. An excessive amount of flux generates a large quantity of

flux gas, which can cause a deterioration of Solderability.

So apply flux thinly and evenly throughout. (A foaming

system is generally used for flow soldering).

2. Flux containing too a high percentage of halide may

cause corrosion of the outer electrodes unless there is

sufficient cleaning. Use flux with a halide content of 0.1%

max.

3. Do not use strong acidic flux.

4. Do not use water-soluble flux.

(*Water-soluble flux can be defined as non rosin type flux

including wash-type flux and non-wash-type flux.)

o Set temperature and time to ensure that leaching of the

outer electrode does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

shown right) and 25% of the length A-B shown below as

mounted on substrate.

[As a Single Chip]

[As Mounted on Substrate]

5. Flow Soldering

A

B

C

D

Outer Electrode

A

B

1. A crack may be caused in the capacitor due to the stress

of the thermal contraction of the resin during curing

process.

The stress is affected by the amount of resin and curing

contraction.

Select a resin with small curing contraction.

The difference in the thermal expansion coefficient

between a coating resin or a molding resin and capacitor

may cause the destruction and deterioration of the

capacitor such as a crack or peeling, and lead to the

deterioration of insulation resistance or dielectric

breakdown.

Select a resin for which the thermal expansion coefficient

is as close to that of capacitor as possible.

A silicone resin can be used as an under-coating to buffer

against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions

may cause the deterioration of the insulation resistance of

a capacitor.

An epoxy resin can be used as a less hygroscopic resin.

7. Coating

Notice (Soldering and Mounting)

37

1

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C03E.pdf

10.5.20