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SSM2537ACBZ-R7 Scheda tecnica(PDF) 16 Page - Analog Devices |
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SSM2537ACBZ-R7 Scheda tecnica(HTML) 16 Page - Analog Devices |
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16 / 16 page ![]() SSM2537 Data Sheet Rev. 0 | Page 16 of 16 OUTLINE DIMENSIONS Figure 34. 9-Ball Wafer Level Chip Scale Package [WLCSP] (CB-9-5) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option SSM2537ACBZ-R7 −40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-5 SSM2537ACBZ-RL −40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-5 EVAL-SSM2537Z Evaluation Board 1 Z = RoHS Compliant Part. A B C 0.560 0.500 0.440 1.240 1.200 SQ 1.160 1 2 3 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) END VIEW 0.300 0.260 0.220 0.80 REF 0.80 REF 0.40 REF SEATING PLANE 0.230 0.200 0.170 COPLANARITY 0.05 BALL A1 IDENTIFIER ©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10981-0-10/12(0) |
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