THS3112

THS3115

SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGED DEVICE

EVALUATION

SOIC-8

SOIC-8 PowerPAD

SOIC-14

TSSOP-14

MODULES

(D)

(DDA)

(D)

(PWP)

0°C to +70°C

THS3112CD

THS3112CDDA

THS3115CD

THS3115CPWP

THS3112EVM

THS3115EVM

40°C to +85°C

THS3112ID

THS3112IDDA

THS3115ID

THS3115IPWP

(1)

For the most current specification and package information, refer to the Package Option Addendum located at the end of this data sheet

or see the TI web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature (unless otherwise noted).

UNIT

33 V

Input voltage

275 mA

Differential input voltage

±4 V

Maximum junction temperature

+150°C

Total power dissipation at (or below) +25°C free-air temperature

See Dissipation Ratings Table

Commercial

0°C to +70°C

Industrial

–40°C to +85°C

Commercial

–65°C to +125°C

Industrial

–65°C to +125°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The THS3122 and THS3125 may incorporate a PowerPAD™ on the underside of the chip. This pad acts as a heatsink and must be

connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the

PowerPAD™ thermally-enhanced package.

DISSIPATION RATINGS TABLE

PACKAGE

POWER RATING

D-8

1.32 W

DDA

67°C/W

1.87 W

D-14

1.88 W

PWP

37.5°C/W

3.3 W

(1)

These data were taken using the JEDEC proposed high-K test PCB.

package and 122.3°C/W for the D-14 package.

2

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Product Folder Link(s): THS3112 THS3115