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STPS2200 Scheda tecnica(PDF) 4 Page - STMicroelectronics |
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STPS2200 Scheda tecnica(HTML) 4 Page - STMicroelectronics |
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4 / 9 page ![]() Characteristics STPS2200 4/9 DocID024381 Rev 1 Figure 7. Thermal resistance junction to ambient versus copper surface under each lead (SMB) Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (SMBflat) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMB SCu(cm²) Epoxy printed circuit board FR4 copper thickness = 35 µm Rth(j-a) (°C/W) Rth(j-a) (°C/W) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMBflat Epoxy printed circuit board FR4 copper thickness = 35 µm SCu(cm²) |
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