LPV521 datasheet(2/29 Pages) TI

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LPV521

SNOSB14C – AUGUST 2009 – REVISED FEBRUARY 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance(3)

Human Body Model

2000V

Machine Model

200V

Charge-Device Model

1000V

Any pin relative to V-

6V,

−0.3V

IN+, IN-, OUT Pins

V+ + 0.3V, V– – 0.3V

V+, V-, OUT Pins

40mA

Differential Input Voltage (VIN+ - VIN-)

±300 mV

Storage Temperature Range

−65°C to 150°C

Junction Temperature(4)

150°C

Mounting Temperature

Infrared or Convection (30 sec.)

260°C

Wave Soldering Lead Temp. (4 sec.)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device

is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test conditions, see the

Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

Operating Ratings

(1)

Temperature Range(2)

−40°C to 125°C

Supply Voltage (VS = V

+ - V−)

1.6V to 5.5V

Package Thermal Resistance (

θJA)

(2)

5-Pin SC70

456 °C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device

is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test conditions, see the

Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

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