UPD750004A datasheet(73/84 Pages) NEC

73 / 84 page

µPD750004, 750006, 750008, 750004(A), 750006(A), 750008(A)

15. RECOMMENDED SOLDERING CONDITIONS

The

µPD750004, µPD750006, and µPD750008 should be soldered and mounted under the conditions recom-

mended in the table below.

For detail of recommended soldering conditions, refer to the information document

SMD Surface Mount Technology

Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact our sales personnel.

Table 15-1

Surface Mounting Type Soldering Conditions

µPD750004GB-×××-3BS-MTX

: 44-pin plastic QFP (10

× 10 mm, 0.8 mm pitch)

µPD750006GB-×××-3BS-MTX

: 44-pin plastic QFP (10

× 10 mm, 0.8 mm pitch)

µPD750008GB-×××-3BS-MTX

: 44-pin plastic QFP (10

× 10 mm, 0.8 mm pitch)

µPD750004GB(A)-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)

µPD750006GB(A)-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)

µPD750008GB(A)-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)

Caution Use of more than one soldering method should be avoided (except for partial heating method).

Table 15-2

Insertion Type Soldering Conditions

µPD750004CU-×××

: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)

µPD750006CU-×××

: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)

µPD750008CU-×××

: 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)

µPD750004CU(A)-××× : 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)

µPD750006CU(A)-××× : 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)

µPD750008CU(A)-××× : 42-pin plastic shrink DIP (600 mil, 1.778 mm pitch)

Package peak temperature: 235

°C

Duration: 30 seconds max. (at 210

°C or above)

Maximum allowable number of reflow processes: 3

Package peak temperature: 215

°C

Duration: 40 seconds max. (at 200

°C or above)

Maximum allowable number of reflow processes: 3

Solder bath temperature: 260

°C max.

Duration: 10 seconds max.

Number of times: 1

Preliminary heat temperature: 120

°C max. (package surface temperature)

Terminal temperature: 300

°C max.

Duration: 3 seconds max. (per device side)

IR35-00-3

VP15-00-3

WS60-00-1

Infrared reflow

VPS

Wave

soldering

Partial heating

method

Soldering

method

Soldering conditions

Soldering method

Soldering conditions

Wave soldering (terminal only)

Partial heating method

Solder bath temperature: 260

°C max., Duration: 10 seconds max.

Terminal temperature: 300

°C max., Duration: 3 seconds max. (for each pin)

Caution Apply wave soldering to terminals only. See to it that the jet solder does not contact with the chip

directly.

Symbol

UPD750004A Scheda tecnica(PDF) 73 Page - NEC

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