UPD78P324LP datasheet(70/80 Pages) NEC

70 / 80 page

µPD78P324, 78P324(A)

Table 9-2. Soldering Conditions for Surface-Mount Type (2)

µPD78P324GJ(A)-5BJ

: 74-pin plastic QFP (20 x 20 mm)

µPD78P324GJ(A1)-5BJ

: 74-pin plastic QFP (20 x 20 mm)

µPD78P324GJ(A2)-5BJ

: 74-pin plastic QFP (20 x 20 mm)

Soldering Method

Soldering Condition

Infrared reflow

Package peak temperature: 235

°C; time: within 30 secs (210 °C or more);

count: twice; day limit: 7 daysNote (hereafter, pre-baked for 36 hrs at 125

°C)

(1) The second reflow should be started after the temperature of the device

which would have been changed by the first reflow has returned to

normal.

(2) Please avoid flux water washing after the first reflow.

VPS

Package peak temperature: 215

°C; time: within 40 secs (200 °C or more);

count: within twice; day limit: 7 daysNote (hereafter, pre-baked for 36 hrs at

125

°C)

(1) The second reflow should be started after the temperature of the device

which would have been changed by the first reflow has returned to

normal.

(2) Please avoid flux water washing after the first reflow.

Wave soldering

Solder bath temperature: no more than 260

°C; time: within 10 secs; count:

once; preheating temperature: up to 120

°C (package surface temperature);

day limit: 7 daysNote (hereafter, pre-baked for 36 hours at 125

°C)

Pin part heating

Pin temperature: no more than 300

°C; time: within 3 secs (per device side)

Recommended

Condition Symbol

IR35-367-2

VP15-367-2

WS60-367-1

—

Note

Refers to the number of days for storage after the dry pack is opened. The storage conditions are 25

°C

and no more than 65 %RH.

Caution

Avoid using two or more soldering methods at the same time (except the pin part heating method).

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