TMP007 datasheet(36/55 Pages) TI

36 / 55 page

ADR1

SCL

SDA

AGND

V+

ALERT

Two-Wire

Controller

TMP007

2.5 V to 5.5 V

0.1 µF

ADR0

DGND

10 k

V+

TMP007

SBOS685C – APRIL 2014 – REVISED JULY 2015

www.ti.com

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP007 is a complete IR thermopile sensor system on a chip that includes the sensing element, signal

conditioner, ADC, and math engine to calculate object and die temperatures. The TMP007 is ideal for

applications where the object cannot be placed in thermal contact with a conventional temperature sensor.

Common reasons for noncontact temperature sensing are:

•

Distance; the object is too far away, or in an inconvenient location for wired connections.

•

The object is in motion.

•

Direct contact of the object is inconvenient or uncomfortable (for example, skin).

•

The object is a fluid (that is, liquid or gas).

•

The object is hazardous (for example, acid or flammable).

•

The object is in a hazardous state (for example, high voltage).

8.2 Typical Applications

8.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common Versus Unit Calibration

Figure 53. Typical Application Circuit

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