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WBC Scheda tecnica(PDF) 1 Page - TT Electronics.

Il numero della parte WBC
Spiegazioni elettronici  Discrete or tapped schematics
PDF  3 Pages
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Produttore elettronici  TTELEC [TT Electronics.]
Homepage  http://www.ttelectronics.com/
Logo TTELEC - TT Electronics.

WBC Scheda tecnica(HTML) 1 Page - TT Electronics.

  WBC Datasheet HTML 1Page - TT Electronics. WBC Datasheet HTML 2Page - TT Electronics. WBC Datasheet HTML 3Page - TT Electronics.  
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Wire Bondable
Chip Resistors
WBC Series
Discreteortappedschematics
MILinspectionavailable
High resistor density
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 1 of 3
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
High resistor density
WBC Series
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil® tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil® resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Absolute Tolerance
to ±0.1%
Absolute TCR
to ±25ppm/°C
Package Power Rating
(@ 70°C)
250mW
Rated Operating Voltage
(not to exceed
P x R )
100V
Operating Temperature
-55°C to +150°C
Noise
<-30dB
Substrate Material
Oxidized Silicon
(10KÅ SiO
2 min)
Substrate Thickness
0.010˝ ±0.001
(0.254mm ±0.025)
Bond Pad
Metallization
Aluminum
10KÅ minimum
Gold
15KÅ minimum
Backside
R0202 and
T0303
Silicon
(Al / Au optional)
B0202
3KÅ Au minimum
10KÅ Al minimum
Passivation
Silicon Dioxide or
Silicon Nitride
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
0.004˝ min bond pad size
Back contact
Top contact
Physical Data
R0202 - Discrete
T0303 - Tapped network ½R + ½R
B0202 - Discrete back contact
Top contact
pad chamfered
R
R
½R
½R
0.004˝ min bond pad size
Electrical Data
Make Possible
Resistors
07.14
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronicsresistors.com
AllpartsarePb-freeandcomplywithEUDirective2011/65/EU(RoHS2)


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