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SHTW2 Scheda tecnica(PDF) 5 Page - List of Unclassifed Manufacturers

Il numero della parte SHTW2
Spiegazioni elettronici  Ultra-small flip chip package: 1.30.70.5 mm3
PDF  14 Pages
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Produttore elettronici  ETC2 [List of Unclassifed Manufacturers]
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SHTW2 Scheda tecnica(HTML) 5 Page - List of Unclassifed Manufacturers

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Version 2 – August 2016
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Figure 5 Timing diagram for digital input/output pads. SDA directions are seen from the sensor. Bold SDA lines are controlled by the
sensor, plain SDA lines are controlled by the micro-controller. Note that SDA valid read time is triggered by falling edge of preceding toggle.
4 Interface Specifications
The SHTW2 supports I2C fast mode (SCL clock frequency
from 0 to 400 kHz) with clock stretching. For detailed
information on the I2C protocol, refer to NXP I2C-bus
specification and user manual UM10204, Rev. 4,
February 13, 2012:
http://ics.nxp.com/support/documents/interface/pdf/I2C.bu
s.specification.pdf
The SHTW2 comes in a 4-pin flip chip package – see
Table 7.
Pin Name Comments
1
VDD
Supply voltage
2
SCL
Serial clock,
bidirectional
3
SDA
Serial data,
bidirectional
4
VSS
Ground
Table 7 SHTW2 pin assignment (top view).
Power-supply pins supply voltage (VDD) and ground
(VSS) must be decoupled with a 100 nF capacitor that
shall be placed as close to the sensor as possible – see
Figure 6.
SCL is used to synchronize the communication between
microcontroller and the sensor. The master must keep the
clock frequency within 0 to 400 kHz as specified in Table
6. The SHTW2 may pull down the SCL line when clock
stretching is enabled.
The SDA pin is used to transfer data in and out of the
sensor. For safe communication, the timing specifications
defined in the I2C manual must be met.
To avoid signal contention, the microcontroller must only
drive SDA and SCL low. External pull-up resistors (e.g.
10 kΩ) are required to pull the signal high. For
dimensioning resistor sizes please take bus capacity
requirements into account. It should be noted that pull-up
resistors may be included in I/O circuits of
microcontrollers.
Figure 6 Typical application circuit, including pull-up resistors
RP and decoupling of VDD and VSS by a capacitor.
For good performance of the SHTW2 in the application, it
is important to know that the solder balls of the SHTW2
offer the best thermal contact to the temperature sensor.
The humidity sensor is centered on the bottom side of the
package and must not be obstructed by underfill or other
material. For more information on design-in, please refer
to the document “SHTxx Design Guide”.
SCL
70%
30%
tLOW
1/fSCL
tHIGH
tR
tF
SDA
70%
30%
tSU;DAT
tHD;DAT
DATA IN
tR
SDA
70%
30%
DATA OUT
tVD;DAT
tF
1
2
3
4
A
BC
XY
SDA
SCL
GND
VDD
MCU (master)
R
P
R
P
SCL OUT
SDA OUT
SDA IN
SCL IN
SHTW2
(slave)



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