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SHTW2 Scheda tecnica(PDF) 5 Page - List of Unclassifed Manufacturers |
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SHTW2 Scheda tecnica(HTML) 5 Page - List of Unclassifed Manufacturers |
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5 / 14 page ![]() www.sensirion.com Version 2 – August 2016 5/14 Figure 5 Timing diagram for digital input/output pads. SDA directions are seen from the sensor. Bold SDA lines are controlled by the sensor, plain SDA lines are controlled by the micro-controller. Note that SDA valid read time is triggered by falling edge of preceding toggle. 4 Interface Specifications The SHTW2 supports I2C fast mode (SCL clock frequency from 0 to 400 kHz) with clock stretching. For detailed information on the I2C protocol, refer to NXP I2C-bus specification and user manual UM10204, Rev. 4, February 13, 2012: http://ics.nxp.com/support/documents/interface/pdf/I2C.bu s.specification.pdf The SHTW2 comes in a 4-pin flip chip package – see Table 7. Pin Name Comments 1 VDD Supply voltage 2 SCL Serial clock, bidirectional 3 SDA Serial data, bidirectional 4 VSS Ground Table 7 SHTW2 pin assignment (top view). Power-supply pins supply voltage (VDD) and ground (VSS) must be decoupled with a 100 nF capacitor that shall be placed as close to the sensor as possible – see Figure 6. SCL is used to synchronize the communication between microcontroller and the sensor. The master must keep the clock frequency within 0 to 400 kHz as specified in Table 6. The SHTW2 may pull down the SCL line when clock stretching is enabled. The SDA pin is used to transfer data in and out of the sensor. For safe communication, the timing specifications defined in the I2C manual must be met. To avoid signal contention, the microcontroller must only drive SDA and SCL low. External pull-up resistors (e.g. 10 kΩ) are required to pull the signal high. For dimensioning resistor sizes please take bus capacity requirements into account. It should be noted that pull-up resistors may be included in I/O circuits of microcontrollers. Figure 6 Typical application circuit, including pull-up resistors RP and decoupling of VDD and VSS by a capacitor. For good performance of the SHTW2 in the application, it is important to know that the solder balls of the SHTW2 offer the best thermal contact to the temperature sensor. The humidity sensor is centered on the bottom side of the package and must not be obstructed by underfill or other material. For more information on design-in, please refer to the document “SHTxx Design Guide”. SCL 70% 30% tLOW 1/fSCL tHIGH tR tF SDA 70% 30% tSU;DAT tHD;DAT DATA IN tR SDA 70% 30% DATA OUT tVD;DAT tF 1 2 3 4 A BC XY SDA SCL GND VDD MCU (master) R P R P SCL OUT SDA OUT SDA IN SCL IN SHTW2 (slave) |
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