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Version 2 – August 2016

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9 Technical Drawings

9.1 Package Outline

Figure 10 Package outline drawing of the SHTW2.

9.2 Recommended Metal Land Pattern

Figure 11 Recommended metal land pattern for SHTW2 (all dimensions are in mm). Recommended solder paste stencil thickness is 75 to

100 µm. The solder pads on the PCB are recommended to be non solder mask defined (NSMD). Copper traces leading towards the solder

pads are recommended to have a width of max. 0.09 mm in the direct vicinity of the pads. For general information on land pattern design

refer to the IPC-7351 standard.

Dim.

Min.

Nom.

Max.

A

-

0.16

-

B

0.71

0.74

0.77

C

1.28

1.31

1.34

D

0.38

0.40

0.42

E

0.38

0.40

0.42

F

0.78

0.80

0.82

G

0.48

0.54

0.60

H

0.12

0.15

0.18

M

0.17

0.20

0.23

0.4

0.24

Solder pad dimensions (copper)

Solder paste dimensions (stencil opening)

Package outline