Data Sheet

HMC557A

Rev. C | Page 5 of 23

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

NIC

NIC

GND

LO

GND

2

3

4

5

6

18

17

16

15

14

13

NIC

HMC557A

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NO INTERNAL CONNECTION.

2. CONNECT THE EXPOSED PAD TO A

LOW IMPEDANCE THERMAL AND

ELECTRICAL GROUND PLANE.

GND

RF

GND

NIC

NIC

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 5 to 7, 11 to

14, 18 to 24

NIC

No Internal Connection. No connection is required on these pins. These pins are not internally

connected. However, all data is measured with these pins connected to RF/dc ground externally.

2, 4, 8, 10, 15, 17

GND

Ground Connect. Connect these pins and the package bottom to RF/dc ground.

3

LO

Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω.

9

IF

Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc,

block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency

range. For operation to dc, this pin must not source or sink more than 2 mA of current or device

nonfunctionality or device failure may result.

16

RF

Radio Frequency Port. This pin is dc-coupled and matched to 50 Ω.

EPAD

Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground plane.