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Motore di ricerca datesheet componenti elettronici |
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AD9528 Scheda tecnica(PDF) 48 Page - Analog Devices |
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AD9528 Scheda tecnica(HTML) 48 Page - Analog Devices |
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48 / 68 page  Data Sheet AD9528 Rev. C | Page 47 of 67 The second step in evaluating the operating conditions is to multiply the power dissipated by the thermal impedance to determine the maximum power gradient. For this example, a thermal impedance of θJA = 21.1°C/W was used. Example 1 (1358 mW × 21.1°C/W) = 29°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 29°C = 114°C This junction temperature is below the maximum allowable. Example 2 (1630 mW × 21.1°C/W) = 34°C With an ambient temperature of 85°C, the junction temperature is TJ = 85°C + 34°C = 119°C This junction temperature is greater than the maximum allowable. The ambient temperature must be lowered by 4°C to operate in the condition of Example 2. THERMALLY ENHANCED PACKAGE MOUNTING GUIDELINES See the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), for more information about mounting devices with an exposed paddle. |
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