RM024 – RAMP Wireless Module

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/ramp

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Laird’s surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.

Ultimately, it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven

temperatures during reflow meet the requirements of the solder paste. Laird’s surface-mount modules conform

to J-STD-020D1 standards for reflow temperatures.

IMPORTANT: During reflow, modules should not be above 260°C and not for more than 30 seconds.

Figure 6: Recommended reflow temperature

Temperatures should not exceed the minimums or maximums presented in Figure 6.

Table 6: Reflow temperatures

Specification

Value

Unit

Temperature increase/decrease rate (maximum)

3

°C/Second

Temperature decrease rate (goal)

2-3

°C/Second

Soak temperature increase rate (goal)

.5-1

°C/Second

Flux soak period (minimum)

60

Seconds

Flux soak period (maximum)

90

Seconds

Flux soak temperature (minimum)

150

°C

Flux soak temperature (maximum)

190

°C

Time above liquidus (maximum)

60

Seconds

Time above liquidus (minimum)

20

Seconds

Time in target reflow range (goal)

30

Seconds

Time at absolute peak (maximum)

30

Seconds

Liquidus temperature (SAC305)

217

°C

Lower target reflow temperature

225

°C

Upper target reflow temperature

250

°C

Absolute peak temperature

260

°C