L6739 datasheet(7/30 Pages) STMICROELECTRONICS

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L6739

Connection diagram and pin description

2.2

Thermal data

8COMP

Error amplifier output.

Connect with an RF - CF to FB. The device cannot be disabled by grounding this pin.

9FB

Error amplifier inverting input.

Connect with a resistor RFB to VSEN and with an RF - CF to COMP.

VSEN

Output voltage monitor.

It manages OVP and UVP protections and PGOOD. Connect to the positive side of the

load for remote sensing. See Section 6 on page 13 for details.

FBG

Remote ground sense.

Connect to the negative side of the load for remote sensing.

CSN

Current sense negative input.

Connect to the output-side of the main inductor. Filter with 100 nF (typ.) to GND.

CSP

Current sense positive input.

Connect through an R-C filter to the phase-side of the main inductor.

OSC

Oscillator, internally set to 1.24 V, it allows programming the switching frequency FSW of

the device, according to the resistor ROSC connected to GND with a gain of 10 kHz/µA

(see Section 7 on page 16 for details). If floating, the switching frequency is 200 kHz.

VCC

Device power supply.

Operative voltage is 5 V to 12 V bus. Filter with 1

F MLCC to GND.

For proper operations, VCC needs to be > 1.5 V higher than the programmed VOUT.

GND

All internal references, logic and driver return path are referenced to this pin. Connect to

the PCB GND ground plane and filter to VCC and VCCDR.

Thermal

PAD

The thermal pad connects the silicon substrate and makes good thermal contact with the

PCB. Use VIAs to connect to the PGND plane.

Table 2. Pin descriptions (continued)

Pin no.

Name

Function

Table 3. Thermal data

Symbol

Parameter

Value

Unit

RTHJA

Thermal resistance junction to ambient

(device soldered on 2s2p PC board)

°C/W

RTHJC

Thermal resistance junction to case

°C/W

TMAX

Maximum junction temperature

150

°C

TSTG

Storage temperature range

-40 to 150

°C

Junction temperature range

-40 to 125

°C

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