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L6739 Scheda tecnica(PDF) 21 Page - STMicroelectronics

Il numero della parte L6739
Spiegazioni elettronici  CPU and DSP power supply
PDF  30 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6739 Scheda tecnica(HTML) 21 Page - STMicroelectronics

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L6739
Application details
30
To place the poles and zeros of the compensation network, the following suggestions may
be followed:
a)
Set the gain RF / RFB in order to obtain the desired closed loop regulator
bandwidth according to the approximated formula (suggested values for RFB are
in the range of some k
):
Equation 12
b)
Place FZ1 below FLC (typically 0.5 * FLC):
c)
Place FP1 at FESR:
d)
Place FZ2 at FLC and FP2 at half of the switching frequency:
e)
Check that compensation network gain is lower than open loop EA gain before
F0dB.
f)
Check phase margin obtained (it should be greater than 45°) and repeat if
necessary.
9.2
Layout guidelines
The L6739 device provides control functions and high current integrated drivers to
implement high current step-down DC-DC converters. In this kind of application, a good
layout is very important.
The first priority when placing components for these applications has to be reserved to the
power section, minimizing the length of each connection and loop as much as possible. To
minimize noise and voltage spikes (EMI and losses) power connections (highlighted in
Figure 11) must be a part of a power plane and realized by wide and thick copper traces:
loop must be minimized. The critical components, i.e. the power MOSFETs, must be close
to one another. The use of a multi-layer printed circuit board is recommended.
The input capacitance (CIN), or at least a portion of the total capacitance needed, has to be
placed close to the power section in order to eliminate the stray inductance generated by
the copper traces. Low ESR and ESL capacitors are preferred, MLCCs are recommended
to be connected near the HS drain.
Use a proper number of VIAs when power traces have to move between different planes on
the PCB in order to reduce both parasitic resistance and inductance. Moreover, reproducing
RF
RFB
----------
F0dB
FLC
------------
V
OSC
VIN
-------------------
=
CF
1
 R
F FLC

-----------------------------
=
CP
CF
2
 R
F CF FESR
1

----------------------------------------------------------
=
RS
RFB
FSW
2F
LC
------------------ 1
---------------------------
=
CS
1
 R
S FSW

-------------------------------
=



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