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ASF130 Scheda tecnica(PDF) 10 Page - Advanced Semiconductor Business Inc. |
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ASF130 Scheda tecnica(HTML) 10 Page - Advanced Semiconductor Business Inc. |
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10 / 11 page ![]() 10/11 ASB Inc. sales@asb.co.kr February 2017 ASF130 5. Package Outline (SOT363, 2.1x2.0x1.0 mm) 6. Surface Mount Recommendation (In mm) 1.48 0.30 0.42 0.50 1.23 0.30 Symbols Dimensions (In mm) MIN NOM MAX A 0.900 1.000 1.10 A1 0.025 0.062 0.10 A2 0.875 0.937 1.00 b 0.200 0.300 0.40 C 0.100 0.125 0.15 D 1.900 2.000 2.10 F 1.150 1.250 1.35 E1 2.000 2.100 2.20 e 0.65BSC e1 1.30BSC L 0.425REF NOTE 1. The number and size of ground via holes in a circuit board are critical for thermal and RF grounding considerations. 2. Recommend is that the ground via holes be placed on the bottom of the ground leads and exposed pad of the device for better RF and thermal performance, as shown in the drawing at the left side. |
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